IEEE Conference on Network Function Virtualization and Software Defined Networks
9–11 November 2021 // Virtual Conference

Technical Program Committee (TPC)

TPC Co-Chairs

Molka Gharbaoui, CNIT, Italy

Antonio de la Oliva, Universidad Carlos III de Madrid, Spain

TPC Members

Kiril Antevski, Universidad Carlos III de Madrid, Spain

Carlos Bernardos, Universidad Carlos III de Madrid, Spain

Gergely Biczók, Budapest University of Technology and Economics, Hungary

Amina Boubendir, Orange Labs, France

Marcus Brunner, Huawei, Switzerland

Yueping Cai, Chongqing University, China

Georgiana Caltais, University of Konstanz, Germany

Ramon Casellas, Centre Tecnològic de Telecomunicacions de Catalunya (CTTC/CERCA), Spain

Ranganai Chaparadza, IPv6 Forum, Germany

Don Clarke, Telecom Foresight Consulting, LLC, USA

Mauro Conti, University of Padua, Italy

Chiara Contoli, University of Bologna, Italy

Daniel Corujo, University of Aveiro, Portugal

Tommaso Cucinotta, Scuola Superiore Sant’Anna, Italy

Luca Davoli, University of Parma, Italy

Roberto Doriguzzi-Corin, Fondazione Bruno Kessler, Italy

Flavio Esposito, Saint Louis University, USA

Milan Groshev, Universidad Carlos III de Madrid, Spain

Rentao Gu, Beijing University of Posts and Telecommunications, China

Carlos Guimarães, Universidad Carlos III de Madrid, Spain

Oliver Hohlfeld, Brandenburg University of Technology, Germany

Larry Horner, Intel, USA

Osamah Ibrahiem, National Chiao Tung University, Taiwan

Ludovic Jacquin, Hewlett Packard Labs, United Kingdom (Great Britain)

Harshvardhan Joshi, Cisco Systems, Inc., USA

Holger Karl, Hasso Plattner Institute, Germany

Andreas J. Kassler, Karlstad University, Sweden

Kenneth Kerpez, ASSIA, Inc., USA

Michail Alexandros Kourtis, NCSR Demokritos, Greece

Diego Lopez, Telefonica I+D, Spain

Evangelos Markakis, Hellenic Mediterranean University, Greece

Jorge Martín-Pérez, Universidad Carlos III de Madrid, Spain

Barbara Martini, CNIT, Italy

Catalin Meirosu, Ericsson, Sweden

Oliver Michel, Princeton University, USA

Nicolae Paladi, Lund University, Sweden

Evangelos Pallis, Hellenic Mediterranean University, Greece

Spyros Panagiotakis, Hellenic Mediterranean University, Greece

Younghee Park, San Jose State University, USA

Helge Parzyjegla, University of Rostock, Germany

Roberto Riggio, Università Politecnica Delle Marche, Italy

Sasko Ristov, University of Innsbruck, Austria

Nico Saputro, Florida International University, USA

Stefano Secci, Cnam, France

Kohei Shiomoto, Tokyo City University, Japan

Marco Tacca, University of Texas at Dallas, USA

Javid Taheri, Karlstad University, Sweden

Samer Talat, Industrial Technology Research Institute, Taiwan

Roman-Valentyn Tkachuk, Blekinge Institute of Technology, Sweden

Reza Tourani, Saint Louis University, USA

Kurt Tutschku, Blekinge Institute of Technology, Sweden

Yuefeng Wang, Akamai Technologies, Inc, USA

Charles H.-P. Wen, National Yang Ming Chiao Tung University, Taiwan

Gaogang Xie, Institute of Computing Technology, Chinese Academy of Sciences, China

George Xilouris, NCSR Demokritos, Greece

Tianliang Zhang, University of Texas at Dallas, USA

Additional Reviewers

Patrik Arlos, Blekinge Institute of Technology, Sweden

Levente Csikor, National University of Singapore, Singapore

Dragos Ilie, Blekinge Institute of Technology, Sweden

Eduard Marin, Telefonica I+D, Spain

Reza Mohammadi, Bu-Ali Sina University, Iran

Mario Patetta, Cnam, France

Michael I.-C. Wang, National Chiao Tung University & NYU Tandon School of Engineering, Taiwan

Zheng Wu, Nanjing University of Posts and Telecommunications, China

2021 Patrons

  • Intel logo

    Platinum

  • Spirent logo

    Silver

  • ETSI logo

    Technical

  • BTH logo

    Technical